LDS Segment in Molded Interconnect Devices (MID) Market is Projected to Grow At a CAGR of 15% by 2024

LDS molded interconnect devices (mid) market is expected to grow at a CAGR of over 15% over the forecast timespan. Several industrial and aerospace & defense manufacturers are developing compact and advanced models by integrating mechanical & electrical functions in a single product. This helps manufacturers to save production costs and offer aesthetically-improved features along with the reduction in their production times. With miniaturization driving the consumer electronics industry, the LDS market is growing in popularity by allowing smaller designs with integrated functionalities. These processes have presented new and efficient forms of production from a single component to mass production and have also led to innovative product designs, thereby driving the LDS MID market demand.

Molded Interconnect Devices (MID) market is poised to witness an accelerated growth over the ensuing years, amidst the backdrop of the frequent technological advancements in telecommunication sector. The ability of the device to facilitate miniaturization has largely added to the expansion of its application portfolio in a range of consumer products.

MIDs have gradually become the prime circuitry solution choice in the automotive and electronics industry, owing to its easy assembling, smaller circuitry. and light weight when compared to conventional PCB circuits. It is prudent to mention that the eco-friendly tag that these devices carry is one of the major factors fueling the molded interconnect devices (mid) market growth worldwide. These devices reportedly incorporate thermoplastic materials that are recyclable and do not involve hazardous manufacturing processes.

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In the Asia Pacific molded interconnect devices (mid) market, countries including China, Japan, and South Korea are expected to witness several growth opportunities owing to the presence of major consumer electronics manufacturers. These components enable ease of processing and low energy consumption thereby benefiting the manufacturing companies. Growth in the disposable income and increased spending capacity of consumers in the Asia Pacific region are further providing an impetus to the MID market growth. Penetration and presence of several raw material suppliers and the growth in the export activities from these countries account for large revenue shares in the industry.

Besides the consumer electronics and automotive sectors, one of the most anticipated trends in the molded interconnect devices (mid) market remains the contribution of healthcare fraternity to this space. With rapid R&D investments toward healthcare prototyping gaining prominence, the sector is certain to be a profitable end-user for the molded interconnected devices manufacturers. Global Market Insights, Inc. forecasts the healthcare molded interconnect devices (mid) market to record an appreciable double-digit CAGR of 15% over 2018-2024.

Key industry players operating in the molded interconnect devices (mid) market include MacDermid Enthone, Harting Mitronics, Molex, SelectConnect Technologies, and RTP Company. The designers and electronic developers have expanded their capabilities in the prototyping and functioning of the final device by using advanced 3D design tools such as the Target 3001.

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