Vicor informs that its Power-on-Package technology allows current to be multiplied within the processor package, enabling higher density, bandwidth and efficiency Kyocera Corporation and Vicor Corporation have recently announced a collaboration to offer next-generation Power-on-Package (PoP) solutions, for maximizing performance and minimizing time-to-market for new processor designs and technologies. Under this partnership, Kyocera would be responsible for providing the integration of data delivery and power to the processor with module substrates, organic packages and motherboard designs, Vicor mentioned in a statement. The Power-on-Package current multipliers to enable high current, high density delivery to processors would be provided by Vicor. The collaboration is supposedly aimed at addressing the fast-paced growth of higher performing processors, which in turn has propelled the growth and complexity in high current consumption demands and high speed I/Os proportionately. Vicor informs that its Power-on-Package technology allows current to be multiplied within the processor package, enabling higher density, bandwidth and efficiency. Delivering multiplication of current within the package can lower interconnect losses by around 90%, while allowing the processor package pins to be reclaimed for expanded I/O functionality. Essentially, the advanced Power-on-Package technology of Vicor enables Vertical Power Delivery (VPD) from the processor's bottom side. The VPD seemingly eliminates losses in Power Delivery Network while ensuring maximum I/O capability and design flexibility, Vicor stated. The company's Power-on-Package solutions had been featured at the China ODCC 2018 Summit as well as the NVIDIA GPU Technology Conference 2018. The proprietary solutions of Kyocera that optimize reliability and performance of processors are allegedly based on decades of module, motherboard and package manufacturing experience worldwide. By deploying Vicor's Power-on-Package devices in several applications, Kyocera has cultivated expertise in design. Apparently, Kyocera is able to provide optimal designs for complex I/O routing, high current power delivery and high speed memory routing by use its design technology, manufacturing expertise and simulation tools. This partnership will allow Vicor and Kyocera to bring advanced solutions for high performance processor applications and Artificial Intelligence to the market.